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The Shanghai World of Packaging (SWOP), a pivotal event in the packaging and processing industry, has announced a significant change in its schedule. Beginning in 2024, SWOP will transition from a biennial event to an annual one, signifying a dynamic response to the evolving demands of the market. This shift, undertaken under the umbrella of the Interpack alliance, highlights SWOP’s commitment to addressing local market needs and fostering global collaboration within the packaging sector.
As anticipation builds for SWOP 2023, it has been confirmed that the event will reoccur in 2024. This decision is rooted in a surge of interest from both exhibitors and attendees. The contemporary packaging industry is characterized by accelerated cycles of innovation, particularly in areas such as sustainability and digitalization. The annual cadence of SWOP aligns seamlessly with this rapid pace of change, providing an apt platform for unveiling novel developments and trends within the packaging and processing domain.
Until now, SWOP adhered to a biennial rhythm, but this shift to an annual schedule empowers industry players to showcase their advancements more frequently, aiding visibility enhancement, customer retention, and market positioning.
Embracing Market Dynamics and Recovery
Thomas Dohse, the director of the Interpack alliance, acknowledged the significance of this stride:
“With this step, we recognize the needs of the very dynamic Chinese packaging market. A shorter interval between events has been met here with great interest. Regular participation allows companies to increase their visibility, improve customer retention, and strengthen their position in the market.”
The decision to accelerate SWOP’s frequency aligns with the ongoing economic recovery post the Covid-19 crisis. Simultaneously, the trade fair sector is regaining momentum. An early response to SWOP 2023, jointly organized by Messe Düsseldorf Shanghai and Adsale Exhibition Services, attests to the industry’s enthusiasm for these events.
Pioneering Packaging Evolution
In a world of expanding global consumer markets and rapid technological evolution, the packaging industry has emerged as a pivotal driver of business growth in China. This sector’s evolution is marked by a dual focus on specialization and innovation, alongside a commitment to environmental stewardship and sustainability. By showcasing novelties, fostering technological dialogues, and facilitating new industry connections, trade fairs like SWOP offer an ideal platform for achieving these goals.
Exploring SWOP’s Diverse Spectrum
SWOP spans an extensive spectrum of topics, encompassing artificial intelligence, sustainable packaging, smart factories, printing and labeling, processing and packaging components, packaging container manufacturing, e-commerce and shipping solutions, packaging materials and design, and personalized packaging. Attendees gain access to innovative omnichannel packaging solutions and intelligent processing and packaging production guidelines. These offerings are enriched by a robust support program and dedicated special zones.
Mark Your Calendars
The upcoming SWOP event is scheduled from November 22 to 24, 2023, in Shanghai. Envisioned as a gathering of around 700 exhibitors and 25,000 industry professionals from both China and abroad, it promises to be an enlightening experience. Looking ahead, SWOP 2024 is already penciled in for November 18 to 20, continuing its residency in Shanghai.